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摘要
环氧塑封材料是半导体产品封装用的主要材料。简要介绍了环氧塑封材料的生产技术,综述了全球环氧塑封材料主要生产企业、供求现状及预测,从供应、进出口、需求和供需平衡等4个方面分析了国内环氧塑封材料供需现状和未来趋势,并给出了未来发展建议。
Abstract
Epoxy molding compound (EMC) is the main material used in packaging semiconductor products.The production technology for EMC material was briefly introduced,and reviewed worldwide main EMC producers,supply/demand status and projection.From the aspects of production,import and export,consumption as well as balance between supply and demand,China's status and future trend of EMC were analyzed and expected.In addition,corresponding suggestions were given for China's EMC industry.
关键词
环氧塑封材料
/
半导体
/
封装
Key words
epoxy molding compound
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semiconductor
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packaging
国内外半导体用环氧塑封材料供需现状及预测[J].
化工新型材料, 2021, 49(12): 37-39 DOI:10.19817/j.cnki.issn 1006-3536.2021.12.008
[1] 陈昭.环氧模塑料(EMC),E-mail:的设计和性能[J].电子工业专用设备,2010,181(2):43-49.
[2] 王龙兴.2019年中国集成电路封装测试业的状况[J].集成电路应用,2020,37(4):1-3.
[3] 安徽省安庆市生态环境局.安徽晶凯电子材料有限公司集成电路电子封装材料基地(安庆)项目(一期)环境影响报告书[EB/OL].[2018-01-19].http://aqxxgk.anqing.gov.cn/show.php？id=592195.
[4] 中国半导体行业协会封装分会.国半导体封装关键材料产业调研报告[EB/OL].[2018-12-17].http://www.chipmanufacturing.org/h-nd-596.html.
